- MediaTek introduces Dimensity 9300+, a powerhouse mobile chip for flagship smartphones.
- Dimensity 9300+ offers enhanced AI processing with NeuroPilot Speculative Decode Acceleration technology.
- Features an All-Big-Core design with 3rd generation TSMC 4nm process for optimal performance.
- Equipped with advanced gaming capabilities including hardware raytracing engine and HyperEngine technologies.
- Boasts Imagiq 990 ISP for exceptional imaging, even in low-light conditions.
- Supports on-device LoRA Fusion, latest LLMs, and ExecuTorch Delegation for AI applications.
- Includes 5G R16 modem for fast and reliable connectivity.
Main AI News:
In the relentless pursuit of innovation, MediaTek has unveiled its latest marvel: the Dimensity 9300+. Representing the zenith of mobile chip technology within MediaTek’s esteemed Dimensity portfolio, the Dimensity 9300+ promises an unparalleled leap in performance and functionality for flagship smartphones.
“The Dimensity 9300+ marks a significant milestone in our commitment to fostering a dynamic ecosystem of generative AI applications,” remarked JC Hsu, Corporate Senior Vice President at MediaTek. “With its expansive support for Large Language Models (LLMs) and on-device LoRA Fusion, this chip sets a new standard for AI-driven user experiences.”
Powered by an All-Big-Core architecture and harnessing the cutting-edge 3rd generation TSMC 4nm process, the Dimensity 9300+ boasts a formidable lineup of cores, including one Arm Cortex-X4 core clocked at up to 3.4 GHz, alongside three Cortex-X4 cores and four Cortex-A720 cores. This robust configuration ensures lightning-fast performance across a spectrum of tasks, from everyday multitasking to intensive gaming sessions.
Moreover, MediaTek’s relentless pursuit of AI excellence shines through with the integration of NeuroPilot Speculative Decode Acceleration technology. This groundbreaking innovation propels the Dimensity 9300+ to new heights, enabling it to effortlessly handle LLMs with billions of parameters at unprecedented speeds. With NeuroPilot Speculative Decode Acceleration, the Dimensity 9300+ achieves a remarkable throughput of 22 tokens per second for LLMs with seven billion parameters, firmly establishing its dominance over competing solutions.
But the Dimensity 9300+ isn’t just a powerhouse for AI processing—it’s also a gaming juggernaut. Equipped with a second-generation hardware raytracing engine and an Arm Immortalis-G720 GPU, this chip delivers a gaming experience that transcends boundaries. Gamers can now immerse themselves in lifelike environments, complete with console-grade global illumination effects, all while enjoying silky-smooth gameplay at a consistent 60 FPS.
To further elevate the gaming experience, MediaTek introduces its latest HyperEngine technologies, including the MediaTek Adaptive Gaming Technology (MAGT). MAGT optimizes power efficiency during gaming sessions, ensuring prolonged battery life and optimal device temperatures. Additionally, the chip leverages HyperEngine’s new Network Observation System (NOS) to enhance WiFi/Cellular dual-network concurrency, providing users with a seamless online gaming experience.
Beyond gaming, the Dimensity 9300+ empowers users to unleash their creativity with unparalleled imaging capabilities. MediaTek’s Imagiq 990 ISP, coupled with advanced AI Semantic Analysis Video Engine, delivers stunning photos and videos even in challenging low-light conditions. With features like real-time video capture and AI scene segmentation, users can capture every moment with breathtaking clarity and detail.
Conclusion:
MediaTek’s Dimensity 9300+ sets a new benchmark for flagship smartphones, offering unparalleled AI capabilities, gaming performance, imaging prowess, and connectivity. This advancement signifies a significant leap forward for the market, ushering in a new era of mobile computing where innovation knows no bounds. Companies operating in the smartphone industry must adapt swiftly to capitalize on these advancements or risk being left behind in a rapidly evolving landscape.
