- DeepX transitions from Samsung Foundry to TSMC for NPU SoC manufacturing, partnering with Asicland.
- The deal, valued at 10 billion won, focuses on utilizing TSMC’s 12nm node for enhanced production capabilities.
- DeepX aims to deliver engineering samples from TSMC’s facilities by next year, targeting robotics and drone applications.
- Despite the shift, DeepX maintains ties with Samsung Foundry for its existing portfolio.
- The company’s diverse lineup includes the M1 chip, AI accelerator H1, and V series of NPU SoCs, tailored for various applications.
- DeepX’s strategic pivot reflects the growing demand for NPUs in edge AI processing, driving efficiency and cost savings.
- Recent funding from Skylake Equity Partners and BNW Investment underscores DeepX’s market potential and strategic vision.
Main AI News:
DeepX, the cutting-edge AI chip startup, is poised for a significant transformation as it shifts its manufacturing partnership to TSMC, according to sources familiar with the matter. This strategic move marks a departure from its previous collaboration with Samsung Foundry’s Gaonchips and underscores DeepX’s commitment to leveraging TSMC’s advanced capabilities.
Asicland, TSMC’s esteemed design house partner, clinched the deal with DeepX, signaling a pivotal moment in the AI chip industry. The agreement entails the utilization of TSMC’s state-of-the-art 12-nanometer (nm) node for the production of DeepX’s innovative System-on-Chip (SoC), featuring a neural processing unit (NPU).
Reports suggest that the deal, valued at approximately 10 billion won, positions DeepX for exponential growth in the AI hardware sector. Under the terms, DeepX will spearhead NPU design, collaborating closely with Asicland to integrate essential interface IP and other specifications, ensuring seamless compatibility with TSMC’s manufacturing processes. Anticipated engineering samples are slated to roll out from TSMC’s facilities by next year, marking a significant milestone in DeepX’s journey.
Targeting applications in robotics and drone technology, DeepX’s forthcoming NPU SoC, fabricated on TSMC’s 12nm node, boasts specialized capabilities in vision processing. This strategic alignment underscores DeepX’s unwavering commitment to innovation and market leadership.
Despite the transition to TSMC, sources indicate that DeepX remains steadfast in nurturing its partnership with Samsung Foundry. The company’s diverse portfolio, encompassing the M1 chip, AI accelerator H1, and the V series of NPU SoCs tailored for IP cameras and drones, underscores its multifaceted approach to AI hardware development. Notably, products such as the M1 and H1 leverage Samsung Foundry’s cutting-edge 5nm node, while the V series is optimized for the 28nm process.
Industry insiders anticipate single-run productions for DeepX’s existing lineup, catering to niche markets with precision and agility. Engineering samples of these chips, meticulously crafted using Samsung Foundry’s expertise, have already garnered acclaim from a multitude of customers, further solidifying DeepX’s foothold in the competitive landscape.
Looking ahead, all eyes are on DeepX’s choice of foundry for its advanced 3nm node, as the company sets its sights on developing next-generation NPU SoCs. With a particular emphasis on edge AI chips tailored to process large language models like ChatGPT, DeepX remains at the forefront of innovation, poised to reshape the future of AI hardware.
This strategic pivot underscores the burgeoning demand for NPUs in edge AI processing, as organizations seek to harness the transformative power of AI at the endpoint. By embracing edge AI solutions, businesses can unlock unprecedented efficiencies while mitigating reliance on cloud-based infrastructure, thereby driving down operational costs and enhancing scalability.
In a testament to its visionary leadership and disruptive potential, DeepX recently secured funding from Skylake Equity Partners, a prominent private equity firm helmed by industry stalwart Chin Dae-je. With strategic investments from BNW Investment, led by CEO Kim Jae-wook, DeepX is poised to embark on its next chapter of innovation and growth, reaffirming its position as a trailblazer in the AI hardware landscape.
Conclusion:
DeepX’s strategic move to partner with TSMC for NPU SoC production signifies a significant shift in the AI chip industry. By leveraging TSMC’s advanced capabilities, DeepX is poised to enhance its competitive edge and drive innovation in edge AI processing. This strategic pivot underscores the evolving dynamics of the market, where demand for specialized AI hardware solutions continues to soar, fueling opportunities for growth and disruption.
