TL;DR:
- Samsung Electronics unveiled advanced foundry technology innovations at the Samsung Foundry Forum 2023.
- The focus is on addressing customer needs in the AI era through advanced semiconductor technology.
- Highlights include expanded applications of the 2nm process, increased production capacity, and the launch of the Multi-Die Integration (MDI) Alliance.
- Samsung aims to lead the industry with its 2nm process, which offers improved performance and power efficiency compared to previous generations.
- The company is strengthening its supply chain by expanding capacity in South Korea and the United States.
- The MDI Alliance aims to revolutionize packaging technology for 2.5D and 3D Heterogeneous Integration.
- Samsung is actively collaborating with partners in the foundry ecosystem to accelerate innovation and provide comprehensive solutions.
- The announcements reflect Samsung’s commitment to remaining at the forefront of the semiconductor market.
Main AI News:
In a bold display of technological prowess, Samsung Electronics, a global leader in advanced semiconductor technology, unveiled its latest foundry technology innovations and strategic vision at the highly anticipated 7th annual Samsung Foundry Forum (SFF) 2023.
Themed “Innovation Beyond Boundaries,” this year’s forum delved into Samsung Foundry’s mission to address the evolving needs of customers in the artificial intelligence (AI) era through cutting-edge semiconductor technology.
Drawing a crowd of over 700 esteemed guests, including industry partners and customers, this grand event witnessed the participation of 38 leading companies, each hosting their own booths to share the latest trends in the ever-evolving foundry industry.
Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics, expressed his confidence in Samsung Foundry’s ability to stay ahead of the technology innovation curve and meet customer needs. “Our gate-all-around (GAA)-based advanced node technology is set to play a pivotal role in supporting our customers’ AI applications,” he stated. Dr. Choi emphasized that the success of their customers remains the core value driving Samsung Foundry’s commitment to delivering exceptional foundry services.
As part of its overarching business strategy to solidify its position as a leading foundry service provider, Samsung Foundry made several significant announcements at the forum:
- Expanded applications of its highly anticipated 2-nanometer (nm) process and specialty process
- Increased production capacity at Pyeongtaek fab Line 3 (P3)
- Introduction of the groundbreaking “Multi-Die Integration (MDI) Alliance” for next-generation packaging technology
- Continued progress in the foundry ecosystem through collaborations with Samsung Advanced Foundry Ecosystem (SAFE™) partners
Charting New Frontiers with Expanded 2nm Applications and Specialty Processes
During the event, Samsung unveiled its detailed plans for the mass production of the revolutionary 2nm process, showcasing its exceptional performance levels.
The company’s timeline for mass production of the 2nm process is set to begin in 2025 for mobile applications, followed by high-performance computing (HPC) in 2026 and automotive applications in 2027. Compared to Samsung’s 3nm process (SF3), the 2nm process (SF2) boasts a remarkable 12% increase in performance, a 25% improvement in power efficiency, and a 5% reduction in overall area.
Mass production of SF1.4 is slated to commence as planned in 2027.
Starting in 2025, Samsung will provide foundry services for 8-inch gallium nitride (GaN) power semiconductors, catering to a diverse range of consumer, data center, and automotive applications.
In its relentless pursuit of cutting-edge technology, Samsung is also developing the 5nm Radio Frequency (RF) process to meet the demands of the forthcoming 6G era. This highly anticipated technology is expected to be available in the first half of 2025, offering a remarkable 40% increase in power efficiency and a 50% reduction in area compared to the previous 14nm process. Furthermore, Samsung plans to expand its automotive applications to include its 8nm and 14nm RF processes, extending beyond the current focus on mobile applications.
Strengthening the Supply Chain and Meeting Expanding Customer Needs Through Increased Capacity
Adhering to its “Shell-First” operational strategy, designed to enhance responsiveness to customer demands, Samsung Foundry is committed to investment and capacity expansion by establishing new manufacturing lines in Pyeongtaek, South Korea, and Taylor, Texas. These expansion plans are projected to increase the company’s clean room capacity by an impressive 7.3 times by 2027, compared to the levels observed in 2021.
The company aims to commence mass production of foundry products for mobile and other applications at Pyeongtaek Line 3 in the second half of this year. Simultaneously, Samsung is directing its focus toward bolstering its manufacturing capacity in the United States. Construction of the new fabrication plant in Taylor is progressing according to the initial plans, with completion expected by year-end and operations set to begin in the second half of 2024.
Additionally, Samsung will further expand its production base to Yongin, South Korea, a city situated approximately 10 kilometers east of Samsung’s Hwaseong and Giheung campuses. This strategic move will power the next generation of Samsung’s foundry services.
Pioneering the “Beyond Moore” Era with the Multi-Die Integration Alliance
Recognizing the rapid growth in the chiplet market for mobile and HPC applications, Samsung is launching the Multi-Die Integration (MDI) Alliance in collaboration with its partner companies and key players in memory, substrate packaging, and testing.
The MDI Alliance aims to revolutionize stacking technology by creating a robust packaging technology ecosystem for 2.5D and 3D Heterogeneous Integration. Together with its ecosystem partners, Samsung will provide a comprehensive turnkey service to better support customers in their technological innovation endeavors.
Samsung plans to proactively address the ever-evolving needs of customers and the market by developing customized packaging solutions tailored to specific applications, including HPC and automotive sectors.
Forging New Paths with Collaborative Fabless Support
Following the Samsung Foundry Forum, Samsung is set to host the Samsung Advanced Foundry Ecosystem (SAFE™) Forum on June 28, focusing on “Accelerating the Speed of Innovation.”
By collaborating with over a hundred partners specializing in electronic design automation (EDA), design solutions, outsourced semiconductor assembly and test (OSAT), cloud, and intellectual property (IP), Samsung is spearheading mutual growth within the foundry ecosystem to drive the success of its customers.
Samsung has been at the forefront of promoting collaboration between partners across the foundry ecosystem, expanding the boundaries of design infrastructure from 8-inch to the latest gate-all-around (GAA) process. With 23 EDA partners offering over 80 design tools and 10 OSAT partners dedicated to developing 2.5D/3D packaging design solutions, Samsung is empowering its customers through product design services. Furthermore, the company has secured a portfolio of over 4,500 key IPs from 50 global IP partners. Samsung’s long-standing collaborations with leading IP providers in their respective fields are instrumental in meeting customer requirements in the domains of AI, HPC, and automotive.
Jong-wook Kye, Executive Vice President and Head of Design Platform Development, Foundry Business at Samsung Electronics, highlighted the role of SAFE™ partners in simplifying designs amidst increasing complexity resulting from the application of advanced processes and technologies like heterogeneous integration. Kye emphasized Samsung Foundry’s unwavering commitment to fostering consistent growth in the Samsung Foundry ecosystem, both in terms of scale and quality.
Samsung Electronics will be hosting the Samsung Foundry Forum 2023 in South Korea in July, with plans to expand the event to Europe and Asia later in the year, providing opportunities to engage with customers in these regions and further strengthen their global presence.
Conclusion:
Samsung’s strategic vision and technological advancements showcased at the Samsung Foundry Forum 2023 demonstrate their dedication to meeting customer needs in the AI era. The expanded applications of the 2nm process, increased production capacity, and the launch of the MDI Alliance position Samsung as a leader in the industry. By fostering collaboration and providing comprehensive solutions, Samsung aims to accelerate innovation and drive the success of its customers. These developments solidify Samsung’s position in the market and affirm its commitment to pushing boundaries in the semiconductor industry.
