- Samsung unveils latest foundry innovations and AI vision at SFF 2024.
- Introduces SF2Z and SF4U nodes, enhancing power efficiency and performance.
- Emphasizes GAA technology maturity, set to roll out SF3 in 2024.
- Launches Samsung AI Solutions platform for tailored AI offerings.
- Diversifies market reach with increased AI sales and specialized applications.
- SAFE™ Forum 2024 fosters collaborative partnerships for future advancements.
Main AI News:
Samsung Electronics, a trailblazer in cutting-edge semiconductor technology, showcased its latest foundry innovations and delineated its AI-era vision at the Samsung Foundry Forum (SFF) U.S. Held at the company’s Device Solutions America headquarters in San Jose, California, the event underlined Samsung’s commitment to empowering the AI revolution.
In a bid to fortify its position in the AI landscape, Samsung unveiled its updated process technology roadmap, introducing two groundbreaking nodes—SF2Z and SF4U. Moreover, the integrated Samsung AI Solutions platform, amalgamating the prowess of its Foundry, Memory, and Advanced Package (AVP) businesses, promises a comprehensive suite of AI-centric offerings.
Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics, emphasized the pivotal role of high-performance, low-power semiconductors in realizing the full potential of AI applications. The integration of co-packaged optics (CPO) technology, alongside the proven GAA process, is poised to redefine data processing paradigms, empowering customers with holistic AI solutions.
The event witnessed insightful presentations from industry stalwarts such as Arm CEO Rene Haas and Groq CEO Jonathan Ross, highlighting Samsung’s collaborative approach in addressing emerging AI challenges. With around 30 partner companies showcasing their innovations, the event underscored the vibrancy of the U.S. foundry ecosystem and the collective endeavor towards AI advancement.
Advancing Foundry Technologies: Samsung’s Commitment to Innovation
Samsung’s relentless pursuit of innovation is evident in its latest process technology roadmap. The introduction of SF2Z, leveraging optimized backside power delivery network (BSPDN) technology, promises enhanced power efficiency and performance for HPC designs. Meanwhile, SF4U, a 4nm variant incorporating optical shrink, is poised to set new benchmarks in PPA metrics. Samsung reaffirmed its commitment to pushing the boundaries of semiconductor technology with preparations for SF1.4 (1.4nm) underway, signaling its trajectory beyond Moore’s Law.
Empowering AI with Gate-All-Around (GAA) Technology
As the AI era unfolds, gate-all-around (GAA) technology emerges as a cornerstone in meeting the demands for power-efficient computing. Samsung’s GAA process, now in its third year of mass production, continues to mature, demonstrating remarkable strides in yield and performance. Leveraging this expertise, Samsung is set to roll out its second-generation 3nm process (SF3), further amplifying its leadership in advanced semiconductor manufacturing.
Driving Collaborative Innovation: Samsung AI Solutions
Central to Samsung’s AI vision is the unveiling of Samsung AI Solutions, an integrated platform harnessing the synergies of Foundry, Memory, and AVP businesses. By fostering cross-company collaborations, Samsung aims to deliver tailor-made AI solutions, offering unparalleled performance and energy efficiency. The streamlined supply chain management ensures accelerated time-to-market, underpinning Samsung’s commitment to customer-centric innovation.
Diversification and Market Expansion: Catering to Varied Applications
Samsung’s efforts extend beyond technological innovation to market diversification, with a notable surge in AI sales reflecting its customer-centric approach. With a diverse portfolio encompassing automotive, medical, wearable, and IoT applications, Samsung is well-positioned to cater to evolving market dynamics, offering bespoke solutions tailored to specific industry requirements.
A Collective Vision for the Future: SAFE™ Forum 2024
Building on the momentum of SFF, Samsung is set to host the Samsung Advanced Foundry Ecosystem (SAFE™) Forum, focusing on the convergence of AI and technology. With industry luminaries set to delve into chip and system design technologies, the forum aims to foster collaborative partnerships and drive collective growth within the foundry ecosystem. The inaugural Multi-Die Integration (MDI) Alliance workshop will further catalyze collaborative efforts, paving the way for innovative solutions in the realm of 2.5D and 3D IC designs.
Samsung’s unwavering commitment to innovation, coupled with its collaborative ethos, underscores its pivotal role in shaping the AI landscape and advancing the boundaries of semiconductor technology.
Conclusion:
Samsung’s comprehensive showcase at SFF 2024 signifies its strategic pivot towards AI-centric semiconductor solutions. With a robust roadmap featuring advanced nodes and matured GAA technology, Samsung is poised to capture a significant share of the burgeoning AI market. The launch of Samsung AI Solutions and collaborative efforts at SAFE™ Forum 2024 underscore Samsung’s commitment to driving innovation and shaping the future of semiconductor technology. This bold step sets the stage for Samsung to emerge as a frontrunner in the AI era, offering tailored solutions to meet diverse customer demands and solidifying its position as a leader in the semiconductor industry.
