Unlocking Next-Gen Potential: AI Chipsets Mirror Human Brain for Efficiency Gains


  • Next-gen AI architecture, developed by Hussam Amrouch at TUM, offers twice the power of current in-memory computing approaches.
  • Utilizes ferroelectric field effect transistors (FeFETs) to combine data storage and processing in transistors, reducing energy consumption.
  • Transistors are a mere 28 nanometers in size, catering to the demand for faster, more efficient chips with lower heat generation.
  • Efficiency is measured by TOPS/W (tera-operations per second per watt), with the new AI chip delivering an impressive 885 TOPS/W, twice that of competing chips.
  • The design draws inspiration from the human brain, with FeFET transistors mimicking neural and synaptic processes.
  • Potential applications include deep learning, generative AI, and robotics, particularly for processing data at the source.
  • Market-ready chips for real-world applications may take several years to materialize, with stringent security requirements in certain industries as a key challenge.

Main AI News:

The relentless pursuit of computational excellence has ushered in a new era of AI hardware innovation. Renowned computer scientist Hussam Amrouch, hailing from the prestigious Technical University of Munich (TUM), has spearheaded the development of an AI architecture that not only promises extraordinary computational power but also mimics the intricate workings of the human brain. This groundbreaking achievement, detailed in the revered pages of Nature, leverages ferroelectric field effect transistors (FeFETs) to revolutionize AI capabilities, setting the stage for transformative advances in generative AI, deep learning algorithms, and robotic applications.

In a paradigm-shifting departure from conventional chip designs, Amrouch’s brainchild incorporates a novel approach—transistors, once reserved solely for calculations, now assume the dual role of data storage. This innovative leap not only conserves invaluable time but also significantly reduces energy consumption, making it an unequivocal win for the AI landscape.

Professor Hussam Amrouch, a luminary in AI processor design at TUM, emphasizes, “As a result, the performance of the chips is also boosted, ushering in an era of unprecedented efficiency.”

The transistors facilitating these remarkable feats measure a mere 28 nanometers, with millions seamlessly integrated into each AI chip. This miniaturization is a pivotal aspect of AI’s evolution, as future chips must outpace their predecessors in speed and efficiency while maintaining optimal temperature control. This is particularly critical for real-time applications like drone navigation during flight, where rapid calculations are paramount.

Professor Amrouch elaborates, “Tasks like this are extremely complex and energy-hungry for a computer, necessitating innovation in chip design.”

Efficiency and power are quantified in the realm of modern chips through the parameter TOPS/W, which is short for “tera-operations per second per watt.” This metric serves as the currency for evaluating the chips of tomorrow. It measures the processor’s ability to perform trillions of operations per second when supplied with one watt of power.

The next-generation AI chip, a collaborative creation between Bosch and Fraunhofer IMPS with production support from US-based GlobalFoundries, boasts an impressive 885 TOPS/W. This monumental leap propels it to a position twice as powerful as its AI chip counterparts, including the formidable MRAM chip developed by Samsung. In stark contrast, the commonly used CMOS chips currently operate within the modest range of 10–20 TOPS/W, underscoring the transformative potential of this technological marvel, as elucidated in recent Nature publications.

Inspired by the architecture of the human brain, the researchers have seamlessly incorporated the brain’s neural and synaptic processes into their chip’s design. Professor Amrouch elucidates, “In the brain, neurons handle the processing of signals, while synapses are capable of remembering this information.” This emulation is achieved through the use of “ferroelectric” (FeFET) transistors, electronic switches imbued with unique characteristics—such as pole reversal when a voltage is applied—that enable the storage of information even in the absence of a power source. Furthermore, FeFETs empower the simultaneous storage and processing of data within the transistors, unlocking new horizons for efficiency in chip design.

Now we can build highly efficient chipsets that can be used for such applications as deep learning, generative AI, or robotics, where data must be processed at the source,” envisions Amrouch.

The path to market-ready chips capable of running deep learning algorithms, recognizing objects in space, and seamlessly processing data from drones in real time is illuminated by this pioneering technology. However, Professor Amrouch, affiliated with the integrated Munich Institute of Robotics and Machine Intelligence (MIRMI) at TUM, cautions that it may be several years before these in-memory chips are ready for real-world applications.

Several challenges, including stringent security requirements in various industries, must be met before widespread adoption. In sectors like automotive, reliability alone won’t suffice; the technology must align with sector-specific criteria.

Professor Amrouch underscores the importance of interdisciplinary collaboration, stating, “This again highlights the importance of interdisciplinary collaboration with researchers from various disciplines such as computer science, informatics, and electrical engineering,” a cornerstone of MIRMI’s distinct strength in this transformative journey.


The development of AI chipsets that mimic the human brain’s efficiency holds immense promise for the market. These chips, with their superior computational power, reduced energy consumption, and compact size, are poised to reshape industries relying on AI technology. However, the path to market readiness and widespread adoption will require addressing security concerns and collaboration across interdisciplinary fields, making it a transformative journey that may span several years.